http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101481710-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 |
| filingDate | 2013-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf054034a037ab6e58ced57d88117892 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74fbbc2842370f064645e570e4b567b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd03b846aa23e53c6917f67da321c5ac |
| publicationDate | 2015-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101481710-B1 |
| titleOfInvention | Adhesive composition for electronic components and adhesive tape using the same |
| abstract | The present invention provides a phenoxy-based pressure-sensitive adhesive composition comprising as a main component a phenoxy resin, a thermosetting agent, an energy ray-curable acrylic resin and a photoinitiator, wherein the (a) aromatic primary amine is used in an amount of 1 to 10 Weight part; (b) 5 to 30 parts by weight of a polymer having an anhydride substituent; And (c) 0.5 to 3 parts by weight of a tertiary amine curing accelerator as an additional component, and an adhesive tape for electronic parts using the adhesive composition. An adhesive tape for electronic parts for electronic parts comprising an adhesive layer on which an aromatic primary amine and a polymer having an anhydride substituent are thermally treated to form an imide structure after the adhesive composition for electronic parts is applied on a base film The adhesion at high temperature is improved and the resin exposure at the encapsulating resin encapsulation process step can be preferably prevented as well as the effect that no residue remains on the attachment surface during peeling. |
| priorityDate | 2013-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.