Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e52e5be12c0fa56974978cbe7b7fff67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3b8f410232cf4b823022f563201e436e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2809 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24273 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2907 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J143-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-8175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
filingDate |
2011-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fed832e993b0db45889899a402caf4b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fe33850514b1071d31fa2cc7e4fbb5e |
publicationDate |
2012-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2012049938-A1 |
titleOfInvention |
Method for manufacturing electronic component |
abstract |
The method of the present invention is provided as a method for manufacturing an electronic component that improves the chip retention characteristics, pickup characteristics, and contamination prevention characteristics for a semiconductor chip with a good balance. The method comprises: an adhesive agent forming step that forms an adhesive semi-cured layer on the rear surface of a wafer; an attaching step for attaching an adhesive sheet to the adhesive semi-cured layer of the wafer and a ring frame and affixing the same; a dicing step that divides the wafer into semiconductor chips; an ultraviolet ray irradiation step that carries out irradiation with ultraviolet rays; and a pickup step that picks up the chips and adhesive semi-cured layer from an adhesive layer. The method uses an adhesive sheet formed by an adhesive having a prescribed composition. |
priorityDate |
2010-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |