| abstract |
An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such as reflow resistance, as well as a film-like adhesive, an adhesive sheet that exhibits excellent process characteristics including ready releasability from dicing sheets, and a semiconductor device that exhibits excellent productivity, superior adhesive strength when heated and superior moisture resistance, all of which use the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by a general formula (I) shown below, and (C) a bifunctional or higher (meth)acrylate compound. (wherein, R1 represents a bivalent organic group containing an aromatic ring and/or a straight-chain, branched or cyclic aliphatic hydrocarbon). |