| abstract |
An adhesive sheet, in which a first test sheet with a width of 25mm is made from an adhesive sheet (1) with a substrate (10) and an adhesive layer (20), and both ends of the first test sheet in the length direction are clamped (101, 102) The tensile strength F A1 when held and stretched by a tensile testing machine for 0.5 mm is the same as the first semiconductor chip (CP1) and the second semiconductor chip (CP2) with a vertical dimension of 45 mm, a horizontal dimension of 35 mm, and a thickness of 0.625 mm. ), the first semiconductor chip (CP1) is attached to one end of the first test piece in the longitudinal direction, and the second semiconductor wafer (CP2) is attached to the other end of the longitudinal direction to make a second test piece. The two ends of the test piece in the longitudinal direction are held by clamps (101, 102) and the tensile strength F B1 when it is stretched by a tensile testing machine for 0.5 mm, which satisfies the relationship of the mathematical formula (1A): F B1 /F A1 ≦30...(number 1A). |