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publicationDate 2013-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201316421-A
titleOfInvention Substrate film for semiconductor processing sheet, semiconductor processed sheet, and method for manufacturing semiconductor device
abstract A base film composed of a resin layer (A) comprising a resin composition containing a resin composition having a resin density of 0.870 to 0.900 g/cm 3 and a melting peak of a heat flux of 2.5 W/g or less and an olefin resin of 10 to 70% by mass. The sheet 2 is a semiconductor processed sheet 1 laminated with an adhesive layer 3 laminated on one surface of the substrate film 2. This semiconductor processed sheet 1 has good topping performance and can suppress the decrease in the ejection performance over time.
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