| abstract |
The present invention can bond an electronic circuit forming substrate or a semiconductor circuit forming substrate and a supporting substrate, has excellent heat resistance when bonding an electronic circuit forming substrate or a semiconductor circuit forming substrate having a thickness of 1 μm or more and 100 μm or less, and an electronic component And a resin composition that can be peeled off under mild conditions at room temperature without changing the adhesive force even during the manufacturing process of semiconductor devices and semiconductor devices, an adhesive using the same, a resin layer, a laminated film, and a processed wafer, Provides an electronic component or semiconductor device manufacturing method using these. The present invention is a resin composition containing at least (a) a polyimide resin having a specific structure and (b) a crosslinking agent containing a fluorene group. |