| abstract |
Provided is a mask-integrated surface protection tape for use in a plasma dicing method, wherein the mask-integrated surface protection tape protects the pattern surface of a semiconductor wafer in a back grinding process with a large degree of thinning, and the surface The mask material layer of the protective tape is excellent in releasability from the base film, has little adhesive residue, and produces few defective chips. In addition, there is provided a mask-integrated surface protection tape which does not require a photolithography process. |