| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-3322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 |
| filingDate |
2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f343bafb31fb269cc585c1a8032d58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f4880606cdaf0fd6c05c1635d3be5ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc858c749c9ec03da2eaecd53626e43b |
| publicationDate |
2014-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014189731-A |
| titleOfInvention |
A temporary adhesive for manufacturing a semiconductor device, an adhesive support using the same, and a method for manufacturing a semiconductor device. |
| abstract |
The present invention can reduce the problem that a temporary adhesive generates gas even during temporary support at a high temperature when a member to be processed (such as a semiconductor wafer) is subjected to a mechanical or chemical treatment. Provided is a temporary adhesive for manufacturing a semiconductor device, which can easily release temporary support for a processed member without damaging the processed member even after passing. A semiconductor device comprising (A) a bifunctional or lower radical polymerizable monomer, (B) a trifunctional or higher functional polymerizable monomer, (C) a polymer compound, and (D) a radical polymerization initiator. Temporary adhesive. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016180456-A1 |
| priorityDate |
2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |