| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf7bf41b630cd67bfaabf3806bfa1a35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e |
| publicationDate |
2019-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019009323-A |
| titleOfInvention |
Dicing tape integrated back protection film |
| abstract |
[PROBLEMS] To suppress cracks on the side surface of a chip in blade dicing for dicing a wafer into chips on a dicing tape (DT) and to realize good pickup of a chip with a back surface protection film from DT. Provided is a DT-integrated back surface protective film suitable for the purpose. A DT-integrated back surface protective film X of the present invention includes a film 10 which is a back surface protective film and a dicing tape 20. The film 10 has a laminated structure including the laser mark layer 11 and the adhesive layer 12, and is in close contact with the pressure-sensitive adhesive layer 22 of the dicing tape 20 on the laser mark layer side. The film 10 that has been subjected to the heat treatment at 120 ° C. for 2 hours has a tensile storage elastic modulus at 80 ° C. of 0.5 GPa or more measured on a film sample piece having a width of 10 mm under predetermined conditions. Between the film 10 and the pressure-sensitive adhesive layer 22, an adhesive strength of 0.1 N / 20 mm or less can be shown in a peel test under a predetermined condition. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020141107-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020161571-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7217175-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7160739-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7350534-B2 |
| priorityDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |