http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020141107-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f1ed54832b5cf422a2565f9c0bfd88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3 |
| publicationDate | 2020-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020141107-A |
| titleOfInvention | Semiconductor back contact film and dicing tape integrated semiconductor back contact film |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor back-adhesive film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back-adhesion film is attached in a semiconductor device manufacturing process, and a semiconductor back-adhesion film integrated with a dicing tape. SOLUTION: The film 10 (semiconductor back contact film) of the present invention has a calorific value in the range of 50 to 200 ° C. in a differential scanning calorimetry at a heating rate of 10 ° C./min, and 130 ° C. and 2 hours. The difference from the calorific value in the range of 50 to 200 ° C. in the differential scanning calorimetry at a heating rate of 10 ° C./min after the heat treatment under the conditions is 50 J / g or less. The dicing tape integrated semiconductor back contact film X of the present invention includes a film 10 and a dicing tape 20. The dicing tape 20 has a laminated structure including a base material 21 and an adhesive layer 22. The film 10 is releasably adhered to the adhesive layer 22 of the dicing tape 20. [Selection diagram] Fig. 2 |
| priorityDate | 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.