| abstract |
The present invention discloses an insulating dielectric film, a manufacturing method thereof, and a multilayer printed circuit board, wherein the insulating dielectric film includes a release film and an insulating dielectric layer disposed on a surface of the release film, and the insulating dielectric layer material is a saturated polyester resin, an amino resin. Or a block isocyanate, an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator. The present invention manufactures an insulating dielectric film having advantages of low dielectric constant, low dielectric loss factor, low thermal expansion and excellent adhesion through introduction of a saturated polyester resin component into an epoxy resin composition. |