| abstract |
Provided is a protective tape which enhances solder bondability and is capable of decreasing the amount of warp of a wafer.nThis protective tape comprises an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer and a base film layer in this order, and satisfies the following conditions expressed by formulae (1)-(3).n(1) Ga > Gbn(2) Ta < Tbn(3) (Ga × Ta + Gb × Tb)/(Ta + Tb) ≤ 1.4E + 06Pan(In formula (1), Ga represents the shear storage modulus of the first thermoplastic resin layer at an application temperature at which the protective tape is applied; and Gb represents the shear storage modulus of the second thermoplastic resin layer at an application temperature at which the protective tape is applied. In formula (2), Ta represents the thickness of the first thermoplastic resin layer; and Tb represents the thickness of the second thermoplastic resin layer. In formula (3), Ga and Gb are as defined in formula (1); and Ta and Tb are as defined in formula (2).) |