| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting sheet and a dicing die bond film having relatively high heat dissipation after curing. SOLUTION: In a dicing die bond film 20, a thermosetting sheet 3 contains a thermosetting resin, a volatile component, and conductive particles. The weight loss rate W1 is 0.5% by mass or less when the temperature is raised from room temperature to 100 ° C. and maintained at 100 ° C. for 30 minutes under a nitrogen flow of 200 mL / min under a temperature rising condition of 10 ° C./min. Yes, the weight loss rate W2 is 2% by mass or more when the temperature is raised from 100 ° C. to 200 ° C. and maintained at 200 ° C. for 30 min under a nitrogen flow of 200 mL / min under a temperature rising condition of 10 ° C./min. Is. [Selection diagram] Fig. 1 |