| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2409-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2471-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2421-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2421-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2447-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2471-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J153-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J147-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4635 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 |
| filingDate |
2016-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019504124-A |
| titleOfInvention |
Bond ply material and circuit assembly formed therefrom |
| abstract |
Compositions for bond plies and circuit subassemblies comprising such bond plies are disclosed. The circuit subassembly may have a UL-94 rating of V-0. The composition of the bond plastic layer comprises 25 to 45 volume percent liquid resin; 10 to 40 weight percent bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least 260 ° C .; and 5 to 50 volume percent inorganic filler. Including. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210001372-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102376112-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021085009-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6905160-B1 |
| priorityDate |
2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |