abstract |
The present invention relates to a dicing film comprising a base film and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a storage modulus at 30 캜 of 3 x 10 5 to 4 x 10 6 Pa and a crosslinking density of the pressure-sensitive adhesive layer of 80% to 99% And a method of dicing a semiconductor wafer using the dicing die-bonding film. |