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filingDate 2010-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101682720-B1
titleOfInvention Semiconductor wafer processing method
abstract The present invention relates to a pressure-sensitive adhesive sheet, a method for producing the pressure-sensitive adhesive sheet, and a semiconductor wafer processing method. The pressure-sensitive adhesive sheet of the present invention has a substrate which is a cured product of a photocurable composition comprising a monomer represented by a specific formula. In the present invention, it is possible to provide a pressure-sensitive adhesive sheet capable of preventing the occurrence of deformation such as warpage or cracking due to the processing process of the semiconductor wafer or the residual stress before and after processing, while forming the base sheet in a single layer structure.
priorityDate 2010-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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