abstract |
The invention provides a dicing tape integrated wafer back surface protective film, comprising: a crystal strip comprising a base material and a pressure sensitive adhesive layer formed on the base material; and a wafer back protective film, It is formed on the pressure-sensitive adhesive layer of the dicing tape, wherein the wafer back surface protective film is colored, and the colored wafer back surface protective film has an elastic modulus (23 ° C) of 3 GPa or more. The colored wafer back surface protective film preferably has a laser marking capability. The dicing tape integrated wafer back surface protective film can be applied to a flip chip mounted semiconductor device. |