Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c4e3691f40afd3ec555105cc14d49797 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1808 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-412 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-1242 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
filingDate |
2020-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4838f55e7413717c9a463a676e44b39c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ade129cbd2ebb10e0defae27e0e883d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb10b7405f6461ddb7aa4b81cfdce34d |
publicationDate |
2020-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2020217955-A1 |
titleOfInvention |
Adhesive film and method for manufacturing electronic device |
abstract |
This adhesive film (50) is an adhesive film comprising: a base material layer (10); an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10); and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and having an adhesive force that decreases by external stimulation. When the mass of the adhesive film (50) after being heated and dried at 130°C for 30 minutes is defined as W1 and the mass of the adhesive film (50) after the heated and dried adhesive film (50) has been caused to absorb water by being left to stand for 24 hours at 25°C in an atmosphere of 50% RH is defined as W2, the average water absorption rate expressed by 100×(W2-W1)/W1 is 0.90 mass% or less. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6984719-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113174214-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113174214-B |
priorityDate |
2019-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |