| abstract |
An adhesive film for temporarily fixing an electronic component capable of suppressing adhesive residue on the support substrate side when the adhesive film is peeled from the support substrate is provided. An adhesive film of the present invention is an adhesive film used for temporarily fixing an electronic component when the electronic component is sealed with a sealing material in a manufacturing process of an electronic device. An adhesive resin layer (A) for temporarily fixing an electronic component, an adhesive resin layer (B) used for adhering to a support substrate, and having an adhesive force reduced by an external stimulus, and an adhesive resin layer An intermediate layer (C) provided between (A) and the adhesive resin layer (B), and the storage elastic modulus E ′ at 120 ° C. of the intermediate layer (C) is 1.0 × 10 5 Pa. The above is 8.0 × 10 6 Pa or less, and the loss tangent (tan δ) at 120 ° C. of the intermediate layer (C) is 0.1 or less. [Selection] Figure 1 |