| abstract |
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure shown by general formula (1); the content of phenoxy resin (B) is 50-500 parts by mass per 100 parts by mass of polyamide resin (A); the content of epoxy resin (C) is 1-60 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B); and the content of phosphorus-based flame retardant (D) is 5-100 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B). |