| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 |
| filingDate |
2018-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102455211-B1 |
| titleOfInvention |
Film adhesive for semiconductor, semiconductor device manufacturing method and semiconductor device |
| abstract |
The film adhesive for semiconductors of this invention is equipped with a 1st contact bonding layer and the 2nd contact bonding layer provided on this 1st contact bonding layer, The elastic modulus in 35 degreeC after hardening is 3.0-5.0 GPa. |
| priorityDate |
2017-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |