| abstract |
It is easy to provide a wafer with a circuit and a support substrate, and the TSV forming step and the wafer back surface wiring step are highly suitable, and the peeling is also easy, and the wafer processing temporary for improving the productivity of the thin wafer can be improved. Next, materials, wafer processed bodies, and manufacturing methods using such thin wafers.nn n n A temporary bonding material for wafer processing, which is a temporary bonding material for wafer processing having a surface on which a wafer and a support substrate are to be processed, and which is capable of being selectively peeled off The first temporary adhesive layer composed of the thermoplastic polyoxygen modified styrene elastomer layer (A) on the surface of the wafer and laminated to the first temporary adhesive layer can be selectively peeled off to the support substrate The second temporary adhesive layer composed of the thermosetting polymer layer (B). |