| abstract |
The present disclosure provides a composition for temporary bonding, including a crosslinker, a polymer and a solvent. The crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxymethyl groups, and each blocked isocyanate group is an isocyanate group protected by a blocking agent. The polymer has a functional group which can react with the crosslinker. Accordingly, the composition for temporary bonding of the present disclosure can have the effects of excellent thermal compression and solvent resistance by different components and formulations. That is favorable for temporary bonding/debonding technology, and can be applied to the semiconductor wafer package. |