| abstract |
The invention relates to an adhesive composition and an organic electronic device containing the same, and to provide an adhesive composition that can form a packaging structure that can effectively block moisture or oxygen from being introduced into the organic electronic device from the outside, thereby ensuring the organic electronic device. Life, and because it is easy to apply in the process of forming the packaging structure of the organic electronic device, the processability can be improved, thereby preventing the problem of air bubbles flowing into the packaging structure or applying nozzle blockage; and the organic electronic device containing the same. |