| abstract |
The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low and making the productivity high, which has good characteristics such as good adhesiveness, good hermetic sealing properties after thermal curing and low moisture absorption that are required for adhesives, which provides a cured film having high reliabilities such as high heat resistance and high light resistance, and which is capable of suppressing warping of a bonded substrate after back grinding that is necessary in the three-dimensional mounting production.nA silicone adhesive composition which contains:n(A) an organopolysiloxane containing a non-aromatic saturated monovalent hydrocarbon group and an alkenyl group;n(B) an organohydrogen polysiloxane containing two or more SiH groups in each molecule in such an amount that the molar ratio of the SiH groups in the component (B) is 0.5-10 relative to the alkenyl groups in the component (A); andn(C) an effective amount of a platinum-based catalyst. |