| abstract |
(57) [Summary] [Problem] It can be designed so that it has no tackiness, has good heat resistance, flexibility, adhesion, and does not deteriorate other coating film properties, and can obtain characteristics particularly suited to the purpose of use. Provided are a photosensitive resin composition for a solder resist and a printed wiring board using the same. (A) An active energy ray-curable resin having at least two ethylenically unsaturated bonds in one molecule, In the photosensitive resin composition containing (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting compound, the above (A) is obtained by adding an unsaturated monocarboxylic acid or a polybasic acid to an epoxy compound. A photosensitive resin composition containing a resin obtained by reacting a compound obtained by sequentially reacting with an epoxy resin, and a printed wiring board using the same. |