| abstract |
An easy-bond film (1) comprises an easy-bond layer (15) on the surface of a transparent film substrate (11). The easy-bond layer (15) contains a binder resin and microparticles. The thickness of the easy-bond layer is preferably 120–260 nm, and the average primary particle size of the microparticles is preferably 0.1–0.9 times the thickness of the easy-bond layer. An easy-bond composition containing the binder resin or a precursor thereof, the microparticles, an alkali component, and a solvent can be applied to the transparent film substrate and heated to form the easy-bond layer. |