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publicationDate 2014-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-5480415-B1
titleOfInvention Adhesive tape for semiconductor wafer processing
abstract Provided is an adhesive tape for processing a semiconductor wafer that satisfies required performance through a dicing process and a pick-up process of a semiconductor wafer that is becoming thinner, reduces chipping, and makes pick-up easy and reliable. An adhesive layer is provided on a base sheet, and a tip shape R = 5.0 ± 0.1 mm with respect to the thickness direction of the base sheet (that is, R = 4.9 to 5.1 mm). ) Indentation at 1 mm / min, and the stress relaxation time change from 0 to 5 seconds from the state of maintaining the displacement where the repulsive stress from the base sheet is 50 N (A) Is 0.23 to 0.28 N / s, and the ratio (B / A) to the stress relaxation time change (B) up to 5 to 10 seconds is 0.40 to 0.45. Adhesive tape. [Selection] Figure 1
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