| abstract |
An object of the present invention is to provide a temporary adhesive material for wafer processing, a wafer processing body, and a method for producing a thin wafer using these, which can relatively easily temporarily adhere a wafer having a circuit to a support substrate, and is suitable for The through-silicon via formation step and the wafer backside wiring step have high step adaptability, and are also easy to peel off, which can improve the productivity of thin wafers. The present invention provides a temporary adhesive material for wafer processing, which is used for temporarily adhering a wafer and a support substrate, the surface of the wafer has circuits and the back surface needs to be processed, and the material is provided with a first temporary adhesion layer and a second temporary adhesion layer; a first temporary adhesion layer; The temporary adhesive layer is adhered to the surface of the wafer in a releasable manner, and is composed of a thermoplastic silicone-modified styrene-based elastomer layer (A); the second temporary adhesive layer is laminated on the first temporary adhesive layer and is It adheres to the support substrate in a peelable manner, and consists of a thermosetting polymer layer (B). |