abstract |
PROBLEM TO BE SOLVED: To temporarily support a member to be processed with high adhesive force when a member to be processed (semiconductor wafer or the like) is subjected to a mechanical or chemical treatment, and to process the member without damaging the member to be processed. A temporary adhesive for manufacturing a semiconductor device, an adhesive support using the temporary support, and a method for manufacturing a semiconductor device can be provided. SOLUTION: (A) A polymer compound that is substantially insoluble in an alkali solution and has a radical polymerizable group in a side chain, (B) a radical polymerizable monomer, and (C) a photo radical polymerization initiator. A temporary adhesive for manufacturing a semiconductor device, an adhesive support using the temporary adhesive, and a method for manufacturing the semiconductor device. [Selection] Figure 1 |