Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2222-402 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J125-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-402 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J129-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-40 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J129-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-08 |
filingDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd88cce7193f9976ede48b396403b8aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_579148a77ca1d40280c3fa797b54e924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bf89b15da1225640ae32a3b1feefa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c547fce334bed28d09e3d17666e74b5f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d29f26086ba4589c556af186b1107af |
publicationDate |
2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9850406-B2 |
titleOfInvention |
Adhesive resins for wafer bonding |
abstract |
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10475810-B2 |
priorityDate |
2014-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |