| abstract |
Dicing with a pressure-sensitive adhesive for dicing that can be easily picked up without deformation of a semiconductor element and a pressure-sensitive adhesive layer formed by the pressure-sensitive adhesive is provided. To provide a pressure-sensitive adhesive sheet. Moreover, the manufacturing method of the semiconductor element using the said adhesive sheet for dicing and the semiconductor element manufactured with the said manufacturing method are provided. A base polymer, a radiation curable compound containing 5 or more carbon-carbon double bonds in one molecule, and a low molecular weight of 100 to 1000 containing 1 to 4 carbon-carbon double bonds in one molecule. A pressure-sensitive adhesive for a dicing pressure-sensitive adhesive sheet containing a molecular weight component. [Selection] Figure 1 |