abstract |
A silicone-based bonding sheet comprising a sheet of a cross-linked product of ancrosslinkable silicone composition, the composition containing a spherical filler having anparticle size not greater than the thickness of the sheet and an average particle size ofnfrom 50% to 100% relative to the thickness of the sheet. A semiconductor devicencomprising a semiconductor chip, a semiconductor chip attachment site, and a silicon-basednbonding sheet interposed between the chip and the attachment site. |