| abstract |
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The solder powder (103) and the curing agent are present in the resin layer (132), the curing temperature (T1) of the resin layer (132) and the melting point (T2) of the solder powder (103) meet the requirement expressed by the following formula: T1 ≥ T2+20˚C, and the melt viscosity of the resin layer (132) at the melting point (T2) of the solder powder (103) ranges from 50 to 5000 Pa s inclusive. |