| abstract |
According to the solder connection method of the present invention, a first electronic component having a solder bump and a second electronic component having a protruding electrode are connected to the first solder bump and the protruding electrode through an adhesive layer having a flux function. Is a solder connection method in which the height of the first solder bump is set to A [μm] from one surface of the first electronic component, and the height of the protruding electrode from one surface of the second electronic component. When the thickness is B [μm] and the thickness of the adhesive layer is C [μm], A + B> C, the step of arranging the adhesive layer on the first electronic component, and the height of the first solder bump The first solder bumps and the like are deformed so that the sum of A [μm] and the height B [μm] of the protruding electrode is substantially the same as the thickness C [μm] of the adhesive layer. A contact step of bringing the solder bumps into contact with the protruding electrodes. |