| abstract |
Provided are a conductive material and a connection structure capable of efficiently arranging conductive particles on electrodes when used for electrical connection between electrodes. A conductive material according to the present invention has a bisphenol skeleton, a polyether skeleton or an aliphatic skeleton having 3 to 10 carbon atoms, a weight average molecular weight of 8000 or more, and a molecular weight of 500. The following epoxy compound, thermosetting agent, flux, and conductive particles 1 are included, and the conductive particles 1 have solder on a conductive surface. [Selection] Figure 1 |