| abstract |
An object of the present invention is to provide a curable composition for electronic parts that can be cured quickly and can further improve the heat and moisture resistance of a cured product. A curable composition for electronic components according to the present invention includes an epoxy compound having no radical polymerizable group, a curable compound having an epoxy group and a radical polymerizable group, a latent epoxy curing agent, A light or thermal radical polymerization agent and a compound having two or more thiol groups are included. [Selection] Figure 1 |