| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0222 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2015-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dad8bae74be06b33bc72bba5eb59da65 |
| publicationDate |
2016-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016048691-A |
| titleOfInvention |
Conductive paste, connection structure, and manufacturing method of connection structure |
| abstract |
Provided is a conductive paste in which solder particles can be efficiently arranged on electrodes, and conduction reliability between electrodes can be improved. A conductive paste according to the present invention includes a thermosetting component and a plurality of solder particles, and each of the thermosetting component and the solder particles is heated at a temperature rising rate of 10 ° C./min. When the differential scanning calorimetry is performed, the exothermic peak top temperature in the main curing of the thermosetting component is higher than the endothermic peak top temperature in the melting of the solder particles, and the main curing of the thermosetting component. The absolute value of the difference between the exothermic peak top temperature in and the endothermic peak top temperature in melting of the solder particles is 10 ° C. or higher and 70 ° C. or lower. [Selection] Figure 1 |
| priorityDate |
2014-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |