| abstract |
The adhesive composition of the masking tape used in the molding underfill process and the masking tape using the adhesive composition, in particular, the adhesive composition can reduce the epoxy molding compound (EMC) during the molding underfill process The hole trap caused by the flow imbalance can reduce the frequency of errors related to package reliability such as hole swelling. The base film having a high elongation at the molding temperature is used to ensure that the masking tape has a superior film compression ratio, so that the pressure near the exhaust port having an effect on the hole trapping can maintain the high pressure, thereby reducing the occurrence of the hole. The adhesive composition comprises (a) an acrylic copolymer, (b) a thermosetting resin, (c) an energy-ray curable polyurethane resin, (d) an energy-ray curable epoxy resin, (e) an energy-ray initiator, And (f) chemical particles. |