| abstract |
The area of the main surface of the electroconductive adhesive layer which hardened the area C of the main surface of the hardened insulating adhesive layer after the electrically conductive adhesive layer containing electroconductive particle and the insulating adhesive layer are laminated | stacked, and heat-pressurized on predetermined conditions in a lamination direction hereafter. It is related with the adhesive film whose value C / D divided by D is 1.2-3.0.n n n n Adhesive film, connection structure of circuit member, film forming material |