| abstract |
The solventless silicone pressure-sensitive adhesive composition has (A) a polydiorganosiloxane having a monovalent hydrocarbon group having a terminal aliphatic unsaturation and (B) a monovalent hydrocarbon group having a terminal aliphatic unsaturation. Branched polyorganosiloxane, (C) polyorganosilicate resin, (D) olefin reactive diluent, (E) polyorganohydrogensiloxane, (F) hydrosilylation reaction catalyst, and (G) anchor And an additive. The solventless silicone pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during manufacture, shipping, and use. [Selection diagram] Figure 1 |