| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 |
| filingDate |
2018-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2018180594-A1 |
| titleOfInvention |
Film adhesive composite sheet and method for manufacturing semiconductor device |
| abstract |
A film adhesive composite sheet provided with a curable film adhesive on a support sheet, the support sheet having a substrate, and the curable film adhesive having a thickness of 1 to A film-like adhesive composite sheet having a thickness of 60 μm and a product of the Young's modulus of the support sheet and the thickness of the support sheet being 4 to 150 MPa · mm. |
| priorityDate |
2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |