http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I727110-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
filingDate 2017-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_025e7811da0dc0af8ecc2c5081cd42c5
publicationDate 2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I727110-B
titleOfInvention Adhesive sheet for invisible cutting
abstract The present invention provides an adhesive sheet for invisible cutting, which is an adhesive sheet for invisible cutting provided with a substrate and an adhesive layer laminated on one side of the substrate. The substrate is used with a thermomechanical analysis device. The substrate is heated from 25°C to 120°C at a heating rate of 20°C/min, and the substrate is stretched with a load of 0.2g, and the length of the substrate at 60°C is subtracted from the initial length of the substrate. When the change in length of the material is set to △L 60℃ , and the length of the substrate obtained by subtracting the initial length of the substrate at 90℃ is set to △L 90℃ , it conforms to the following The relationship of formula (1): △L 90℃ -△L 60℃ <0μm...(1).n n n The adhesive sheet for stealth dicing has excellent heat shrinkability.
priorityDate 2016-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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