abstract |
The present invention relates to a pressure-sensitive adhesive composition that can be easily peeled off by irradiating light even after high-temperature processing at 300° C. or higher in a state in which an adherend is fixed, an adhesive tape having a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition, and an electronic component The purpose of the present invention is to provide a method for processing The present invention is a pressure-sensitive adhesive composition comprising a reactive resin having a polyimide skeleton in a main chain and a functional group having a double bond in a side chain or a terminal, and a silicone compound or a fluorine compound. |