| abstract |
A resin composition excellent in thermal conductivity, adhesiveness and film formability, and particularly, a resin composition excellent in thermal conductivity after curing. (A) at least one member selected from the group consisting of an aminophenol type epoxy resin, (B) a phenoxy resin and a thermoplastic elastomer, and (C) a high thermal conductive inorganic filler. , And (B) is 0.5 to 5 parts by mass. And the glass transition temperature of the component (B) is less than 50 占 폚. |