| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df9c393a770b8892e50718d2b4df2e5d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2013-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a56014e458a7f6adf00cdc7c12cdb671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_173ba7589445c8cee251def9abca455e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea260c774f2f5492b2e4276f43b1ba19 |
| publicationDate |
2013-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201348387-A |
| titleOfInvention |
Semiconductor sheet for manufacturing semiconductor device and method for manufacturing semiconductor device |
| abstract |
An adhesive sheet for manufacturing a semiconductor device, comprising: a substrate and a thermosetting adhesive layer provided on one surface of the substrate; and being adhered to the lead frame (20) or the wiring substrate of the semiconductor device, wherein The adhesive layer: the strength a before the heating measured in the specific peeling test A is 0.07 N/20 mm or more, and the strength b measured in the specific peeling test B is 0.58 N/20 mm or more, and The strength c after heating measured in the specific peeling test C was 1.17 N/20 mm or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I784129-B |
| priorityDate |
2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |