| abstract |
A wafer processing laminate including a support, a temporary adhesive material layer formed on the support, and a wafer, having a circuit-forming front surface and back surface to be processed, laminated on the temporary adhesive material layer, in which the temporary adhesive material layer is composed of a complex temporary adhesive material layer having a three-layered structure including a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer releasably adhering to the front surface of the wafer, second temporary adhesive layer composed of thermosetting siloxane-modified polymer layer releasably laminated on the first temporary adhesive layer, and third temporary adhesive layer composed of thermosetting siloxane polymer layer releasably laminated on the second temporary adhesive layer and releasably adhering to the support. A temporary adhesive material for a wafer processing facilitates temporary adhesion and separation, and allows separation even when a thin wafer is cut before separation. |