| abstract |
Problem The present invention provides a silicone-based adhesive that has micro-adhesion on the surface, can easily temporarily fix a diced semiconductor chip or the like to a semiconductor substrate, and can form permanent adhesiveness to a to-be-adhered body by secondary curing A sheet, a laminate containing the same, a semiconductor device using the same, and a method for manufacturing the semiconductor device. Solution The peeling mode of the adhesive surface peeling off from other non-adhesive substrates before heating is interface peeling, and after heating the adhesive surface in the range of 50 to 200°C, the adhesive surface is peeled off from other non-adhesive substrates. The peeling mode becomes cohesive failure and has a silicone-based adhesive sheet with permanent adhesiveness; the use of the above-mentioned wafer adhesive film for semiconductors, etc.; A semiconductor device such as a MEMS device with a structure in which a wafer is fixed to a substrate. |