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publicationDate 2017-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170110748-A
titleOfInvention Surface protecting adhesive film for semiconductor wafer and the manufacturing method for the same
abstract A base layer, an intermediate layer and an adhesive layer, wherein the base layer is a resin modified to contain a carboxyl group; And a crosslinking agent, which is a cured film of the composition.
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