| abstract |
The present invention provides a light-irradiation stripping device that has excellent heat resistance when joining a support (during hardening) or processing the back of a wafer, and furthermore, during component mounting, and can be easily peeled off when the support is peeled. Adhesive composition etc.nn n n The adhesive composition for peeling by light irradiation is peelable by light irradiation, and is characterized in that it contains an adhesive component (S) and a light absorbing organic compound (X); the light absorbing organic compound (X) , Which contains one or more aromatic rings in the molecule, one or more rings containing heteroatoms in its ring constituent atoms, and one or more selected from carbonyl and thiocarbonyl. |